HS-S3 Diamond sand line cutting fluid

Introduction

HS-S3 diamond sand the cutting fluid is a two-component, cutting fluid, it is mainly used for all kinds of hard brittle materials (monocrystalline silicon, polycrystalline silicon, germanium, gallium arsenide, quartz, indium gallium nitride, gems, non-metallic materials, etc.) of the cutting process, excellent lubrication, cooling, anticorrosive, antirust, hydrogen suppression function, after cutting surface of the wafer TTV is small, wireless, and can prolong the service life of emery line.